Diamond Tools & Blades
Diamond tooling and precision sectioning blades for cutting and lapping hard materials. This collection covers our diamond wafering blades — sintered metal-bond and plated types sized to fit the major low-speed and precision saws — along with diamond grinding and lapping discs, laps, and made-to-spec diamond tools. Comparable to the diamond blades and tooling from Buehler, Struers, and Allied High Tech, typically 20 to 40 percent lower in price, with many items made to order for non-standard requirements. Used across metallography, ceramics, electronics, and tool-and-die work.
Diamond Tooling by Task
| Tool | Task | Selection Note |
|---|---|---|
| Sintered wafering blade | Sectioning hard materials | Long life and flatness on ceramics, carbides, and geological specimens. |
| Plated wafering blade | Thin, low-kerf sectioning | Delicate work and small or valuable specimens where kerf loss matters. |
| Diamond grinding / lapping disc | Flat material removal | Metal or resin bond for hard materials above the range of SiC paper. |
| Custom diamond tools | Non-standard shapes and sizes | Made to specification — dimensions, grit or micron, bond, and mounting. |
Selecting a Wafering Blade
Match the blade to the material and the saw. Sintered metal-bond blades expose fresh diamond as the bond wears, giving long life and flatness on hard, brittle materials. Plated blades are single-layer and thin, cutting fast with minimal kerf for delicate or small specimens. Confirm the blade outer diameter, arbor hole, and thickness against your saw before ordering. Use continuous coolant and a moderate feed rate on brittle materials to prevent thermal cracking.
Custom and Made-to-Spec Tooling
Many diamond discs, laps, blades, and tools are made to specification for non-standard requirements. Provide the dimensions, grit or micron size, bond type, and mounting or arbor details, and we will confirm the specification and lead time.
Frequently Asked Questions
Which blade type do I need?
Use a sintered metal-bond blade for hard materials and long life, and a thin plated blade for delicate, low-kerf cuts on small or valuable specimens. Match the diameter, arbor hole, and thickness to your saw and specimen, and cut under continuous coolant at a moderate feed rate to minimize thermal damage.
What is the difference between a blade and a diamond disc here?
A wafering blade sections a specimen to size on a saw; a diamond grinding or lapping disc removes material and flattens the cut face on a grinder-polisher platen. Blades come in sintered and plated types; discs come in metal and resin bond, in grits from 120 (P120) through 1200 (P4000).
Do you make custom diamond tools?
Yes. Many diamond discs, laps, blades, and tools are made to specification — send the dimensions, grit or micron size, bond type, and mounting details, and we will confirm the specification and lead time.
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